74HC365 DATASHEET PDF

74HC Semiconductors are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for 74HC Semiconductors. 74HC datasheet, 74HC circuit, 74HC data sheet: PHILIPS – Hex buffer/line driver; 3-state,alldatasheet, datasheet, Datasheet search site for. 74HC datasheet, 74HC pdf, 74HC data sheet, datasheet, data sheet, pdf, Philips, 3-state.

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The English language dataseet the official language used at the semiconductors. The suffix datasheeet denotes tape and real. Important Information and Disclaimer: The suffix T denotes a small-quantity reel of They have high drive current outputs which enable high speed operation even when driving large bus capacitances.

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CPD is used to determine the dynamic dagasheet consumption, per buffer. Samples may or may not be available.

74HC/HCT365; Hex buffer/line driver; 3-state

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CD54/74HC365, CD54/74HCT365, CD54

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The product status of the product s described in the product data sheet may have changed since publication of the data sheet and therefore information in datasheets on product status may be outdated. Not recommended for new designs. Analog and mixed-signal devices. TI’s terms “Lead-Free” or “Pb-Free” mean datasheeg products that are compatible datashfet the current RoHS requirements for all 6 substances, including datashedt requirement that lead not exceed 0. The latest information on product status is published on the product information pages of the above-mentioned websites.

Both circuits are capable of driving up to 15 low power Schottky inputs. If a line 74jc365 indented then it is a continuation of datashest previous line and the two combined represent the entire Device Marking for that device. Product device recommended for new designs. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.

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This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

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74HC 데이터시트(PDF) – System Logic Semiconductor

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