74HC Semiconductors are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for 74HC Semiconductors. 74HC datasheet, 74HC circuit, 74HC data sheet: PHILIPS – Hex buffer/line driver; 3-state,alldatasheet, datasheet, Datasheet search site for. 74HC datasheet, 74HC pdf, 74HC data sheet, datasheet, data sheet, pdf, Philips, 3-state.
|Published (Last):||8 May 2004|
|PDF File Size:||12.5 Mb|
|ePub File Size:||9.54 Mb|
|Price:||Free* [*Free Regsitration Required]|
Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof.
The English language dataseet the official language used at the semiconductors. The suffix datasheeet denotes tape and real. Important Information and Disclaimer: The suffix T denotes a small-quantity reel of They have high drive current outputs which enable high speed operation even when driving large bus capacitances.
Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Nonetheless, such components are subject to these terms. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer’s risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
CPD is used to determine the dynamic dagasheet consumption, per buffer. Samples may or may not be available.
74HC/HCT365; Hex buffer/line driver; 3-state
No rights can be derived from any translation on this website. Documents Flashcards Grammar checker.
Catasheet browser does not support script. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. Users should follow proper IC Handling Procedures.
No TI components are authorized for use in FDA Class III or similar life-critical medical equipment unless datashert officers of the parties have executed a special agreement specifically governing such use.
CD54/74HC365, CD54/74HCT365, CD54
TI and TI suppliers consider certain information to be proprietary, and 744hc365 CAS numbers and other limited information may not be available for release.
Translate this product information page from English to: Buyers are responsible for their products and applications using TI components. The ” is identical to the ” but has non-inverting outputs. TI is not responsible or liable for any such datssheet.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
The product status of the product s described in the product data sheet may have changed since publication of the data sheet and therefore information in datasheets on product status may be outdated. Not recommended for new designs. Analog and mixed-signal devices. TI’s terms “Lead-Free” or “Pb-Free” mean datasheeg products that are compatible datashfet the current RoHS requirements for all 6 substances, including datashedt requirement that lead not exceed 0. The latest information on product status is published on the product information pages of the above-mentioned websites.
Both circuits are capable of driving up to 15 low power Schottky inputs. If a line 74jc365 indented then it is a continuation of datashest previous line and the two combined represent the entire Device Marking for that device. Product device recommended for new designs. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
TI has taken and continues 74c365 take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. Efforts are underway to better integrate information from third parties.
These devices are sensitive to electrostatic discharge. The similar products page includes products from the same catalog tree srelevant selection guides datssheet products from the same functional category. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
TI is not responsible or liable for such altered documentation. In the event of any conflict between product information pages and data sheets or deviations from information provided in the product data sheets on these product information pages, the information provided in the product data sheets shall prevail.
74HC 데이터시트(PDF) – System Logic Semiconductor
The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.